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After being the first to launch the 7nm process and the enhanced 7nm process with EUV (Extreme Ultraviolet Lithography) technology, TSMC (Taiwan Semiconductor Manufacturing Company), the global wafer foundry leader, is set to once again take the lead in mass-producing the next-generation 5nm process in 2020.

According to estimates from foreign media, TSMC’s 5nm process capacity will reach 10,000 wafers per month in the first half of 2020. However, as the third quarter—peak shipment season—approaches, monthly capacity will increase to 70,000–80,000 wafers. It is expected that the first batch of key clients will be Apple and HiSilicon (Huawei’s semiconductor subsidiary).

Reports indicate that the 5nm process will be another critical process node for TSMC. As previously stated by TSMC, the 5nm process will have two versions: N5 and N5P. Compared to the current N7 (7nm) process, the N5 version delivers a 15% performance improvement, a 30% reduction in power consumption, and an 80% increase in transistor density. For the N5P process, it will further achieve a 7% performance boost and a 15% power consumption reduction compared to N5.

Reports emphasize that TSMC has made smooth progress in 5nm process R&D since its inception. Earlier sources suggested that by the end of 2019, during TSMC’s risk production phase for the 5nm process, the average yield rate of test chips had reached 80%, with the highest exceeding 90%. However, the design architecture of these test chips was relatively simple.

Therefore, it remains uncertain whether TSMC can maintain this yield rate once the 5nm process enters official mass production, and TSMC has not yet disclosed relevant data.

Additionally, TSMC plans to officially launch mass production of the 5nm process in the first half of 2020. However, since the new process will have just started mass production, overall capacity will be limited—approximately 10,000 wafers per month. Nevertheless, as orders pour in from major clients such as Apple and HiSilicon, 5nm process capacity will grow closer to the Q3 shipment peak, with a projected maximum of 70,000–80,000 wafers per month to meet client demand at that time.

As for AMD, a major processor manufacturer and one of TSMC’s top five clients, it is expected to continue using the current 7nm and enhanced 7nm processes in 2020. The adoption of the 5nm process for product manufacturing is not anticipated until after 2021, when AMD launches products based on its Zen4 architecture.

Source: Global Semiconductor Observer Official Website (www.dramx.com)